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2Gb: x16, x32 Mobile LPDDR2 SDRAM S4
Package Dimensions
Package Dimensions
Figure 10: 134-Ball FBGA – 11mm x 11.5mm (Package Code MH)
Seating plane
134X ?0.36
A
0.08 A
Dimensions apply to
solder balls post-reflow
on ?0.3 SMD ball pads.
10 9 8 7 6 5 4 3 2 1
Pin A1 index
(covered by SR)
Pin A1 index
A
B
C
D
E
11.5 ±0.1
10.4 CTR
0.65 TYP
0.65 TYP
5.85 CTR
11 ±0.1
F
G
H
J
K
L
M
N
P
R
T
U
0.9 ±0.1
0.22 MIN
Notes:
1. All dimensions are in millimeters.
2. Solder ball material: LF35 (98.25% Sn, 1.2% Ag, 0.5% Cu, 0.05% Ni).
PDF: 09005aef83f3f2eb
2gb_mobile_lpddr2_s4_g69a.pdf – Rev. N 3/12 EN
23
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2010 Micron Technology, Inc. All rights reserved.
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